Model No:OL-3016

Ingredient: Sn42Bi58 Melting point: 138℃

Usage: Lead-free low temperature solder paste,LED type special non-high temperature resistant board is used, general products are not recommended.

Model No:OL-3018

Ingredient: Sn64Bi35Ag1 Melting point: 183℃

Usage: Lead-free medium-temperature solder paste,suitable for non-high-temperature resistant boards. Products with high strength requirements are not recommended

Model No:OL-3019

Ingredient: Sn99Ag0.3Cu0.7 Melting point: 217℃

Usage: Lead-free high-temperature solder paste,suitable for normal circuit board welding, most widely used in SMT process, strong and strong.

Model No:OT-558

Flux:Environmentally friendly halogen-free flux,suitable for repairing all types of circuit boards, and has the best effect on repairing digital mobile phones. High SIR resistance will not cause two repairs.

Model No:L-2015

Tin Absorbing Tape: It has the characteristics of strong tin absorbing ability and no residue.

Please note when using

You use a hot air gun or soldering iron for heating, and the temperature needs to be higher than the melting point of the product, because there will be heat loss during the heating process. You need to let the solder paste melt quickly, so that the welding effect will be better

Solder Paste Parameters

OL-3016 50g:Total Weight - 50g, Net Weight of Paste - 42
OL-3016 30g:Total Weight - 30g, Net Weight of Paste - 22
OL-3016 16g:Total Weight - 16g, Net Weight of Paste - 12